3D Solder Joint Measurement and Centralized Verification of Inspection Results at the SMT Hybrid Packaging 2017

The Latest Test Technologies for Most Problems in Electronics Manufacturing

Connectivity of inspection systems, full 3D inspection of visible and hidden solder joints and components as well as electrical test and in-system programming are all part of the GOEPEL electronic technology range being presented at the SMT Hybrid Packaging 2017 in Nuremberg.  From May 16th to 18th, visitors can see the latest test technologies at booth 222 in hall 4A.

The Vario Line • 3D is an AOI system for 3D solder joint measurement with 360° angled-view inspection. Due to its single field of view, no additional axis movement is needed. Universal and flexible PCB inspection will be represented by the stand-alone system Basic Line.

The THT Line has been purpose developed for customer specific and flexible inspection of THT solder joints and components. The inline AXI system X Line • 3D enables comprehensive 3D X-ray inspection of complex assemblies. The solder paste inspection system SPI Line • 3D provides the earliest possible fault detection. The basis for all test systems on the way to Industry 4.0 provides PILOT Connect and simultaneously allows the most flexible MES connections. In combination with PILOT Supervisor, a centralized verification of all inspection results becomes reality.

JULIET Series 2 is a compact production tester for Embedded JTAG Solutions. With fully integrated test electronics, power supply and changeable needle-bed adapter, it can be flexibly adapted to every UUT.  RAPIDO RPS910 accommodates larger production volumes. It offers reliable inline programming and electrical test within production line cycle times, especially for complex assemblies with components that are difficult to reach.

Vario Line · 3D

Vario Line · 3D

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