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Solder Paste Inspection and Sinter Paste Inspection with Vario Line · 3D SPI
The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is available in various resolution configurations.
The solder paste depots are inspected according to the criteria of shape, height, area, bridges, volume, x/y offset and coplanarity.
The sinter paste inspection also includes the detection of particles, notches, holes and frayings in the depot.
Differences Solder Paste and Sinter Paste
| Attribute | Solder Paste | Sinter Paste |
|---|---|---|
| Paste Height | 80 µm … 150 µm | 20 µm … 50 µm |
| Paste Area | ~ mm² | ~ cm² |
| Structural Size (Paste) | 25 - 45 µm | < 3 µm |
| Test Functions | Height, Area, Volume, Offset, Form, Bridging | Height, Area, Volume, Offset, Form, Bridging, Particle, Notches, Holes, Frayings |
"AME" Applied Micro Electronics
AME located in Eindhoven, Netherlands are using 9 systems from GÖPEL electronic for their SMD and THT production.
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