Vario Line · 3D SPI
The inline system for detection of voids (air pockets) on Direct Copper Bonded (DCB) Substrates
With the highly accurate 3D imaging technology, the system is able to quickly detect voids on DCB substrates from a height of 10 µm. Faults in the structure of the copper layers are reliably detected.
- PILOT SPI - the operator software
- touchscreen interface
- improved algorithms and inspection functions for void inspection
- summary of results from front and back for double-sided inspection