Solder & Sinter Paste Inspection - Multi Line SPI

Multi Line SPI is the cost-effective 3D inline system for inspecting solder and sinter paste. Based on the Multi Line platform, it is the perfect solution for small and medium-sized companies with high quality requirements. The telecentric 3D measurement head is used for shadow-free inspection of solder and sinter paste to verify form, area, coplanarity, height, bridges, and offset. With a resolution of 15 µm in the plane and a height resolution of 0.2 µm, precise and reproducible measurement values can be obtained.

In addition to offering various plug-ins for network communication with your MES system, the system can be linked to the paste printer via a closed-loop interface. HERMES and IPC-CFX interfaces are also available.

Print offset camera view — Detected print offset is reported to the paste printer

Bareboard with solder paste — Inspection of form, height, area, bridges, volume, and coplanarity.
15 µm X/Y resolution
0.2 µm Z resolution
1 µm Z measurement accuracy

An important feature is the combination of SPI result data with the result data from the AOI/AXI. If the AOI/AXI system detects failures, these are displayed together with the SPI results at the verification station. This helps to determine the cause of the failure.

Combining SPI and AOI/AXI data — Combining SPI, AOI and AXI data at the verification station

Screenshot verification station — Combining SPI, AOI and AXI data at the verification station

The generation of an inspection program for solder paste and sinter paste takes only a few minutes. Users who already use GÖPEL electronic software for programming SMD, THT, or CCI systems can learn the additional SPI functions with little training. In addition, the data import, verification, and statistics software are identical to those of other GÖPEL electronic inspection systems.