Solder Paste Inspection and Sinter Paste Inspection

Solder & Sinter Paste Inspection - SPI Line 3D

The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is…

Inspection of Direct Copper Bonded Substrates (DCB)

With the highly accurate 3D imaging technology, the system is able to quickly detect voids on DCB substrates from a height of 10 µm. Faults in the structure of the copper layers are reliably detected.