After a long break, a major electronics trade show is taking place in Germany again for the first time in November. The productronica is back, and from 16-19 November we will also be part of the world's leading show for development & manufacturing in Munich. In hall A1, booth 235 we will present new systems & technologies for test and inspection.
The new X-ray flagship fleX Line · 3D is the focus of our trade show presentation. The AXI machine (Automated X-ray Inspection) offers the user special advantages in terms of flexibility, precision and reliability. The variable belt conveyor can transport both small light and large heavy assemblies. In addition, the system relies on an image acquisition principle in which the DUT is not moved during 2D, 2.5D and 3D X-ray inspection.
The new version 4.8.0 of the SYSTEM CASCON software introduces the latest platform for embedded testing and programming. An automatic scan chain recognition and an overall view of the test setup have been integrated in the ViPX (Visual Project Explorer). Another new feature is the support of iJTAG IEEE1687. This means that iJTAG test instruments and test procedures can be used at PDL levels 0 and 1. Thanks to a new ATGP (test programme generator), all files are automatically imported and made available on a user interface. Overall, the new version 4.8.0. is significantly faster in execution and even more flexible due to customisable interfaces.
The new BARCUDA VP230 system is a turnkey solution for flexible testing, programming and bringing assemblies into functional mode. Electronic assemblies with or without JTAG/Boundary Scan can be tested and programmed without the time-consuming configuration of a special in-house test system. BARCUDA VP230 is equipped with a robust "VPC G12 Receiver" adapter interface from Virginia Panel Corporation (VPC) as standard. This means that the adapter supplier for contacting the boards can be freely selected and any mechanical requirements can be implemented.
In the field of AOI (Automatic Optical Inspection), we will demonstrate the possibility of creating and optimising inspection programmes fully automatically using a digital twin. This means that a real assembly does not necessarily have to be available. The 3D AOI systems now offer another highlight: components with a height of up to 35mm can now also be measured without reducing the resolution for critical inspection tasks such as 3D solder joint inspection.
An assistance function based on artificial intelligence will be presented for verification and repair stations. The innovative AI software module serves to make the final human evaluation and classification of sorted out assemblies more reliable. For each defect on a PCB that requires a decision by the operator, the AI makes its own decision and requests a re-evaluation if the artificial intelligence comes to a different conclusion than the operator. This mechanism can be used to prevent an assembly with an actual defect that was also detected by the AOI or AXI system from being subsequently declared a pass assembly.