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Fast Inspection of Solder and Sinter Pastes

Solder Paste Inspection and Sinter Paste Inspection with SPI Line · 3D

The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is available in various resolution configurations.

The solder paste depots are inspected according to the criteria of shape, height, area, bridges, volume, x/y offset and coplanarity.

The sinter paste inspection also includes the detection of particles, notches, holes and frayings in the depot.

Ines Fietze
Mme Ines Fietze
+49 3641 6896 762 Tél

Differences Solder Paste and Sinter Paste

Attribute Solder Paste Sinter Paste
Paste Height 80 µm … 150 µm 20 µm … 50 µm
Paste Area ~ mm² ~ cm²
Structural Size (Paste) 25 - 45 µm < 3 µm
Test Functions Height, Area, Volume, Offset, Form, Bridging Height, Area, Volume, Offset, Form, Bridging, Particle, Notches, Holes, Frayings


  • high-precision 3D image acquisition through fringe projection technology without moving parts
  • speed-optimized camera head
  • double-sided projection for 100% shadow-free measurement
  • measuring paste heights from 20 µm


  • PILOT SPI - user software
  • touchscreen interface
  • generation of test programs in less than 10 minutes via SPI Wizard
  • closed loop to paste printer
  • data connection with AOI/AXI on a combined repair station
PILOT SPI - user software