Multi Line AOI for THT

Highest quality for inspecting THT components

Multi Line can fully display its flexibility when inspecting THT assemblies. On the one hand, different camera modules can be used for 3D measurements or for the inspection of very tall components.  The system allows transport with or without carriers and applies to the return transport of assemblies in the lower part of the system as well.

Multi Line also enables 3D solder joint inspection of THT assemblies during return transport. This means that a wide range of configuration and integration variants are available, allowing Multi Line to be customized to the specific process and production line layout.

THT component inspection

4 - 8

Angled view cameras

Telecentric

Orthogonal camera

Inspection height

80 mm

Clearance

140 mm

3D THT component and solder joint inspection

  Measurement z-Resolution Measurement height Clearance
Component inspection 3D 1 µm 35 mm 110 mm
Solder joint inspection 3D 1 µm 35 mm 40 mm

One platform - one software - unique

Multi Line AOI is available with the PILOT AOI Version 7 system software, which includes fully automated test program creation with the award-winning MagicClick as well as many other innovative and user-friendly features.

» MagicClick

More about Multi Line AOI for THT

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GÖPEL electronic GmbH