Appel gratuit: +49-3641-6896-0

Solder Paste Inspection and Sinter Paste Inspection

Solder and Sinter Paste Inspection with SPI Line · 3D

The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is…

[Translate to Englisch:] Inspektion von Direct Copper Bonded Substraten (DCB)