Multi Line can fully display its flexibility when inspecting THT assemblies. On the one hand, different camera modules can be used for 3D measurements or for the inspection of very tall components. The system allows transport with or without carriers and applies to the return transport of assemblies in the lower part of the system as well.
Multi Line also enables 3D solder joint inspection of THT assemblies during return transport. This means that a wide range of configuration and integration variants are available, allowing Multi Line to be customized to the specific process and production line layout.
3D THT component and solder joint inspection
| Measurement | z-Resolution | Measurement height | Clearance | |
| Component inspection | 3D | 1 µm | 35 mm | 110 mm |
| Solder joint inspection | 3D | 1 µm | 35 mm | 40 mm |
One platform - one software - unique
Multi Line AOI is available with the PILOT AOI Version 7 system software, which includes fully automated test program creation with the award-winning MagicClick as well as many other innovative and user-friendly features.
