With a new integration package, Teradyne in-circuit tester users can significantly increase their test coverage with JTAG/Boundary Scan. The support of board panels also meets the frequent demand for high throughput rates.
The predefined hardware setup is adapted to the existing interfaces of the Teradyne Spectrum systems (88xx, TSSE). This includes a plug-in card in the system-specific form factor. Software integration is achieved at various levels. On the one hand, all test sequences created via the SYSTEM CASCON platform from GOEPEL electronic can be integrated into the Teradyne test plan via simple DLL calls. The results and diagnostic messages are transferred to the Teradyne test report. On the other hand, it is possible to create interactive tests in which the tester's ICT channels are used as virtual boundary-scan cells. SYSTEM CASCON is able to import the access points exported by the Teradyne software and automatically create additional test patterns from them.
For this the newly developed test type "Interactive ATE" is used, which allows a fast configuration by intelligent filtering. Using various properties or manual selection, networks can be added to the test or excluded from the test. This enables maximum transparency and direct influence on test coverage. The testing of panels with several DUTs is realized by sequential control of the individual assemblies.
With the support of Teradyne-ICTs, GOEPEL electronic extends its integration packages, which increase the test depth of in-circuit testers, manufacturing defects analyzers and flying probe testers.