smart JTAG solutions and a new inspection platform
Future-oriented testing and inspection solutions at electronica
At this year's electronica in Munich, Germany, GOEPEL electronic is presenting groundbreaking innovations at booth A3.351 that will attract a lot of industry attention!
In the world of Embedded JTAG solutions, AI support has been massively expanded, taking CASCON software to a new level. With the Smart Test Coverage Analyzer (smartTCA), GOEPEL electronic is demonstrating the world's first tool for AI-supported test coverage analysis for use with embedded instruments. Based on training from over 1000 projects, the AI process recognizes the structural elements and architecture of the board and, with the help of a transformation process, calculates a theoretically possible test coverage at pin, net, and device level. This enables users to assess the potential of using embedded instruments in a focused way and implement appropriate test strategies.
FlashFOX is also making a big appearance again: the award-winning stand-alone 8-channel programmer impresses with unique features such as WLAN connectivity, an integrated JAM/STAPL player, and a web interface. Other new features, such as the ADYCS automation feature and the new streaming mode, make programming microcontrollers, flash components, and PLD/FPGAs even faster and more flexible. A must for every modern production, especially now that it is also available as a 4-channel version.
Furthermore, the SCANFLEX-TIC portfolio has been expanded, adding the SFX II TIC01/VX plug-in variant with 5V support and the SFX II TIC422/S(R) external add-on variant. Both modules are compatible with preceding TIC variants and have programmable interface parameters.
A new expansion module available for the integration package for Acculogic Flying Prober FLS 980 Dxi enables the automatic generation of interactive tests, thus ensuring maximum transparency as well as high test coverage.
In the field of inspection solutions, the new modular system platform Multi Line sets unique accents: It covers a wide range of configuration options for the quality assurance of electronic assemblies – from component and solder joint inspection (AOI for SMT), solder paste inspection (SPI), inspection of THT components and their solder joints (AOI for THT), to conformal coat inspection (CCI). The flexible all-rounder allows the inspection of PCBAs in the various transport levels of the THT process as well as the double-sided inspection of SMT assemblies without flipping the boards. A uniform system software makes it possible to reduce training costs, facilitates flexible deployment of operators, and saves overall resources.
Multi Line CCI inspects conformal coating fully automatically. Fluorescent coating are made to glow by UV LEDs of different wavelengths. A telecentric lens and a color camera deliver high-contrast 2D images for evaluation. Quick inspection program creation is based on CAD data in combination with an importable coating plan. Coated assemblies can be inspected simultaneously from above and below. It is also possible to return assemblies and product carriers with an optional conveyor in the lower part of the system.
Multi Line Assist, also on display at booth A3.351, is an ingenious addition to the Multi Line system family. The new generation of the AOI module for THT assembly monitors the presence of THT components, their positions, polarity, colors, 2D codes, and labels. It is available in three resolution variants for different requirements and inspection areas. An innovative ambient light suppression enables reliable test results even when the ambient lighting changes. The image brightness is no longer controlled by the intensity of the illumination at the assembly station, but rather by the exposure time of the 47-megapixel camera. This keeps the lighting constant for the personnel at the assembly station. In addition, Multi Line Assist can be combined with a projection unit to support staff during the placement process.