Preparing for the future of inspection: 4-part webinar series on X-ray inspection

Ever smaller, ever denser, ever more compact—modern PCBAs can no longer be inspected with the naked eye. But even AOI—optical inspection—fails when it comes to BGAs, packaging, or other complicated packages. When it comes to quality assurance and reliability, there's only one thing that helps—X-ray. Automatic inline X-ray inspection (AXI) is the method of choice for non-destructive inspection and quality assurance of printed circuit boards (PCBs) and electronic components. It enables the reliable detection of both visible and hidden solder joints – for example, under BGAs, QFNs, or other components with hidden connection structures.

AXI systems from GÖPEL electronic offer high-resolution X-ray technology combined with fast inline capability for modern SMT manufacturing processes. They are suitable for inspecting complex printed circuit boards (PCBs) and ensure maximum test coverage with high throughput.

In our new webinar series from March to June, you will not only discover the automatic AXI solutions from GÖPEL electronic, but also learn the background, tips, and tricks of AXI and how AOI systems check the visible quality characteristics of a PCBA, looking beyond the limits that remain hidden to the human eye or an AOI system.

Register here:

From voids to head-in-pillow: reliably detecting BGA defects with AXI - GÖPEL electronic

Void inspection in manufacturing with AXI: everything you need to know. - GÖPEL electronic

Manual X-ray analysis and random sampling with AXI – An insight into everyday work - GÖPEL electronic

Automatically check solder penetration at THT solder joints with AXI – here's how! - GÖPEL electronic