New camera module for Vario Line and Basic Line with 9.8µm resolution
For better failure detection and fewer false rejects in SMD inspection
GÖPEL electronic has now developed a fundamentally new, powerful camera module for 360-degree inspection for the stand-alone systems of the Basic Line series and for the Vario Line systems. The camera module is the heart of every AOI system and provides the data basis for evaluation. The X250 for the inspection of SMD PCBA offers increased resolution of 9.8µm with revolutionary integrated camera technology, without compromising on speed. This means that even the smallest details are not overlooked.
The combination of telecentric optics and 3D technology – optionally with an oblique view – increases failure detection, reduces false rejects, and thus saves valuable resources. This is made possible by the highest optical quality in terms of projection and image capturing, as well as intelligent software modules that dynamically adjust the inspection parameters according to the respective situation on the PCBA.
The Vario Line systems combine maximum failure detection with high speed, because flexibility is an important competitive advantage in electronics manufacturing. Accordingly, inspection systems must also be dynamically adaptable. Combined 3D and 2D inspection as well as oblique view cameras in 360 1° increments meet high quality standards. Fully automatic generation and optimization of test programs can save a lot of time in the manufacturing process. In addition, the system can also be used for solder paste inspection (SPI).
The stand-alone AOI system Basic Line offers efficient AOI for manufacturers of small batch sizes. It is a device for manual loading and flexible acceptance of different boards, making it particularly suitable for electronics manufacturers in the high mix/low volume sector. Thanks to the flexible configuration options (oblique view, rotary drive, assembly size), it can be individually adapted to the respective requirements.
