GÖPEL electronic at the productronica 2019
New SYSTEM CASCON 4.7 / AOI with Artificial Intelligence / 3D THT / 3D AOI Arena
Inspection and quality assurance, test and programming, from SMD to THT: GÖPEL electronic is the only supplier worldwide to present the full range of Inspection Solutions and Embedded JTAG Solutions - from development to the final product. The solutions for every type of electronics production will be presented at productronica from November 12 to 15 in Hall A1, Booth 235.
The new SYSTEM CASCON Version 4.7 with new features will be introduced for the first time. These include the new Test Coverage Analyzer (TCA) for optimal analysis of the test coverage of the board. The Visual Project Explorer - ViPX serves the simple representation of complex board and test information. Further new features as well as the Embedded JTAG Solutions for small and large production volumes can all be experienced at the booth of GÖPEL electronic.
In the area of inspection solutions, a new era is about to be entered. Artificial intelligence and sophisticated optics of the MultiEyeS plus eliminate interference from light influences and ensure consistent inspection results in assembly processes and THT placement. The THT Line · 3D has a new camera module for fully automatic inspection of THT solder joints in 3D. This allows solder volume, solder flow and pin height to be accurately measured and defects reliably detected. Of course, 3D SMD-AOI, AXI and SPI are also part of GÖPEL electronic's productronica appearance.
In addition, the 3D AOI flagship Vario Line · 3D will be sent into the race of the 3D AOI Arena (Hall A2, Booth 506). Under the motto "Your System", an individual system will be presented which stands out due to flexible basic variants and numerous configuration options. The Vario Line · 3D can be precisely integrated into any production line and is the quality assurance system for tomorrow's production orders with test program generation within minutes, SPI function and flexible MES connection.