Inline X-ray inspection – making the invisible visible with 3D AXI
X ray machine for electronics - assuring quality in modern electronics manufacturing
GÖPEL electronic’s x ray machine for PCBs provides you with comprehensive inspection coverage, detecting critical defects on assembled printed circuit boards at an early stage and in a non-destructive manner.
Multi Line AXI – inline CT system for automatic inspection and manual analysis
With the Multi Line AXI, GÖPEL electronic has launched a high-performance 3D CT X-ray system for the in-line inspection of assembled electronic printed circuit boards. It is used directly on the production line or in test cells. Manual analyses of random samples, field returns and prototypes can also be carried out. This X-ray system from the Multi Line family is designed for the quality assurance of complex, high-value assemblies at high inspection speeds.
Versatile and ‘Made in Germany’, it enables high-resolution 3D CT inspection of both small and light assemblies, as well as large and heavy ones. The printed circuit boards are processed using computed tomography – whilst maintaining an extremely compact footprint and a total weight that allows it to be used in production environments with limited ceiling load capacity. Computed tomography uses X-rays to generate fast, interference-free cross-sectional images of assemblies and individual components. Whether for inspecting BGAs, QFNs, LGAs, LEDs or THTs, or for detecting voids, this is the most advanced method for manufacturing electronics products of assured quality.
The clever arrangement of the X-ray source and detector enables imaging whilst the test specimen is in a vertical position and provides a component clearance of 105 mm. This makes the system ideally suited for inspecting assemblies with tall components.
Today’s electronics manufacturers inspect circuit boards using automated X-ray inspection (3D AXI)
Many components – such as BGAs, QFNs, LGAs and LEDs – have their connections entirely beneath the housing. Visual inspection or optical microscopy alone are not sufficient for inspecting BGAs, amongst others. As a result, many connections remain unchecked, meaning that X-ray inspection methods are required for a more comprehensive assessment.
- Hidden solder defects
- Voids/Lunker
- THT solder penetration
- Bridges, missing solder
- Solder beads and much more
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Adaptive Spot Precision Computer Tomography 
ASPECT™ technology combines optimally coordinated hardware and software components with the aim of producing crystal-clear and highly detailed 3D CT images in the shortest possible time.
At the heart of the X-ray imaging chain is a maintenance-free, sealed wide-angle microfocus X-ray source with a maximum power output of 65 W and integrated spot control. Depending on the set X-ray power, the focal spot is automatically adjusted to the smallest possible spot size – ensuring maximum detail resolution in the X-ray image.
The X-ray source’s wide beam angle enables a tilt view at angles of up to 55° without the need to tilt the detector or test specimen. The result is excellent slice separation and high-precision CT slice images. In combination with a high-performance 6.7-megapixel high-speed detector, large 3D image fields can also be captured in high resolution.
Thanks to the synchronised movement of the axis system and the X-ray imaging chain, the oblique X-ray images required for CT reconstruction are captured directly whilst the system is in motion (‘on the fly’). This results in extremely short cycle times whilst maintaining high image quality.
Your benefits for maximum precision
- particularly detailed and clear X-ray images thanks to an X-ray source with Focal Spot Control
- short cycle times thanks to dynamic CT image capturing
- precise, low-maintenance axis system for fast on-the-fly CT imaging
- intelligent software algorithms for automatic image correction and quality optimisation
- large-area X-ray detector for large image fields whilst maintaining high resolution
The PILOT software further corrects and optimises the captured X-ray images to reliably visualise even the finest structures and details.
Support using an AOI camera
An integrated AOI auxiliary camera also supports X-ray inspection: it detects registration marks, reads codes, generates colour navigation images and, where required, captures colour images for subsequent failure verification at the verification station.
Software platform and scope of testing
The Multi Line AXI is supplied with the tried-and-tested PILOT software platform, which is used for test program generation for all inspection systems, such as AOI, SPI and CCI.
Comprehensive inspection functions are available for BGA, QFN, LGA, LEDs, THT, voids and numerous other applications – ensuring maximum flexibility for a wide variety of PCBAs and requirements.
Whether it’s fully automated in-line inspection or manual analysis of prototypes and random samples – the Multi Line AXI reliably meets a wide range of inspection requirements.
MES connection
The Multi Line AXI has SMEMA and HERMES interfaces. It can also be connected to customer MES systems via MES plug-ins.
Do you have questions or need an inquiry?
Do not hesitate! Write your request via web form or directly by email to inspection.sales@goepel.com
