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07. - 09. May '19

SMTconnect


smtConnect - the next SMT Hybrid Packaging

The event shows technologies from the areas of development, production, services, and applications in connection with microelectronic assemblies and systems.


We will exhibit our Inspection Solutions with AOI, AXI and SPI Systems and Embedded JTAG Solutions

Facts
Organizer
Claudia Mock - Eventmanagement

Claudia Mock
+49-3641-6896-763  Phone
c.mock@goepel.com  Mail

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