31. Jan - 10. Feb '22

Test Convention connect

The testing technology event in digital guise

90 minute web sessions about Inspection Solutions and Embedded JTAG Solutions from GÖPEL electronic.

Register now and be part of several workshops and presentations. We provide the sessions twice for different time zones.

From the assembly control to the solder joint inspection - smart and holistic inspection solutions in the THT process

Lecturer: Dr. Jörg Schambach, GÖPEL electronic GmbH

Monday, 31st January 2022 : 10.00 - 11.00 am UTC
Monday, 31st January 2022 :  5.00 - 6.00 pm UTC

In the manufacturing process of THT assemblies, automatic optical inspection systems are used to check both the assembly and the solder joints. Find out online about the flexible options for the optimal integration of automatic optical inspection systems in the manufacturing process of THT assemblies. The presentation will show how 2D and 3D AOI systems can ensure maximum product quality at the various points in the THT production process. In particular, the technologies required to realise a reproducible inspection of the assembly directly at the assembly station will be addressed. You will also learn what artificial intelligence has to do with the inspection of THT assemblies and what options there are for connecting the inspection systems to in-house MES or traceability systems to achieve maximum traceability.

AXI systems for increasing test coverage - possibilities and limitations

Tuesday, 1st February 2022: 10.00 - 11.30 am UTC
Tuesday, 1st February 2022: 5.00 - 6.30 pm UTC

Lecturer: Andreas Türk, GÖPEL electronic GmbH

Densely populated and complex PCBs usually always have one thing in common: a large number of hidden solder joints under the component housings. These must be inspected to ensure quality and to increase test coverage. Automatic X-ray systems (AXI) provide more safety and control here. The presentation shows which X-ray system concepts are available for the inspection of hidden solder joints (manual vs. automatic inspection). The difference between 2D, 2.5D and 3D X-ray will be explained in detail. Furthermore, it will be shown how 100% X-ray inspection is possible within the production cycle. Here, the fast, scanning 3D X-ray image acquisition is presented. It enables a short cycle time with excellent defect detection.

Many paths lead to the goal – THT manufacturing concepts with AOI and bad board handling

Wednesday, 2nd February 2022: 10.00 - 11.00 am UTC
Wednesday, 2nd February 2022: 5.00 - 6.00 pm UTC

Lecturer: Jens Kokott, GÖPEL electronic GmbH & Christopher Scherf, haprotec

The presentation contains integration concepts of AOI systems into the THT manufacturing process as well as the following bad board handling. An overview of the different possibilities of the line setup will be given with a special focus on the process steps inspection and verification. In addition to theoretical considerations on the integration of AOI systems as well as repair and verification stations, the variants presented will be explained based on real line layouts.

The fast way to the AOI program – with sample board or Digital Twin?

Lecturer: Jens Kokott, GÖPEL electronic GmbH

The Digital Twin of an assembled PCB – auto-generated based on ODB++ Process and Valor Parts Library

Lecturer: Jeremy Schitter, SIEMENS Digital Industry Software

Monday, 7th February 2022: 10.00 - 11.00 am UTC
Monday, 7th February 2022: 5.00 - 6.00 pm UTC

The fully automatic generation of AOI inspection programs with the powerful "MagicClick" function will be demonstrated in the first part of the presentation. A real sample PCB and its digital twin will serve as an example.

The second part shows possibilities of creating a digital twin of an assembled PCB with the software tool ODB++ Process and the Valor Parts Library.

SYSTEM CASCON 4.8.0 - Overview of the new features

Tuesday, 8th February 2022: 10.00 - 11.30 am UTC
Tuesday, 8th February 2022: 5.00 - 6.30 pm UTC

Lecturer: Jan Heiber, GÖPEL electronic GmbH

What's new in the SYSTEM CASCON 4.8.0 release? The presentation/workshop mix explains the latest feature implementations and provides practical examples.

The presentation is aimed at SYSTEM CASCON users who want to familiarize themselves with the latest options to make Boundary Scan project handling more efficient. Highlights are board structure visualization, IEEE1581 DDR RAM testing (Connectivity Test) as well as the support for switches, level  shifters and latches.

System integration in ICT, FPT and FKT

Wednesday, 9th February 2022: 10.00 - 11.30 am UTC
Wednesday, 9th February 2022: 5.00 - 6.30 pm UTC

Lecturer: Alexander Beck, GÖPEL electronic GmbH

The presentation describes advantages of combined test systems and gives a general overview about possible integrations of Embedded JTAG Solutions into 3rd party test equipment such as ICT, Flying Probe and Functional Test.

Target group: test management and system integrators

Workshop: Turnkey solutions for production - JULIET, BARCUDA and RAPIDO

Lecturer: Marc Fuchs & Falk Steingroewer, GÖPEL electronic GmbH

JTAG / Boundary Scan project development from start to finish

Thursday, 10th February 2022: 10.00 - 11.30 am UTC
Thursday, 10th February 2022: 5.00 - 6.30 pm UTC

Lecturer: Alexander Labrada Diaz, GÖPEL electronic GmbH

Did you know how easy it is to develop a JTAG/Boundary Scan project with SYSTEM CASCON? Do you already use advanced technologies like Processor Emulation and FPGA Embedded Instruments?

From importing the CAD data to test creation and programming - here you will learn which data you need and which tools will help you achieve your goal the fastest, including report and documentation of the test coverage.

Workshop: From the laboratory to production - project transfer and troubleshooting

Lecturer: Sven Haubold, GÖPEL electronic GmbH

» register now

  • • 31. Jan - 10. Feb '22 10:00 - 11:30 UTC
Claudia Mock - Eventmanagement

Claudia Mock
+49-3641-6896-763  Phone
c.mock@goepel.com  Mail