From voids to head-in-pillow: reliably detecting BGA defects with AXI

Hidden solder joints under BGAs are among the biggest challenges in electronics manufacturing. In this webinar, we demonstrate how Multi Line AXI precisely inspects BGAs in 3D volume. Defects such as volume deviations, voids, head-in-pillow, short circuits or insufficient wetting are automatically detected. Using practical examples, we show how GÖPEL ASPECT™ technology quickly generates and evaluates high-resolution CT images. Learn how to use BGA inspection as an integral part of your process-capable quality assurance and avoid defects at an early stage.

Speaker: David Kalaidjian, GOEPEL electronics LLC

Participation in this webinar is free of charge. Seats are limited .

Are you unable to attend at the specified time? Register anyway and you will receive the link to the recording afterwards.