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Webinar: Why only sample if a 100% x-ray inspection is possible?

The webinar deals with two different strategies for X-ray inspection of solder joints in modern electronics productions. On the one hand, the manual sample in-process inspection, which is usually carried out by trained personnel in multi-shift operation. On the other hand the fully automatic 100% inspection of each PCB directly in the production line. The advantages and disadvantages of these strategies are presented and a technical and economic comparison is explained.

In addition, the use of an X-line X-ray system for 100% solder joint inspection in the production line is described using a practical example. Free of reflections and shadows, all solder joints are inspected by X-ray technology and are evaluated equally, without human subjectivity. The result is the lowest pseudo-error rate, minimal failure escapes and complete documentation of the test results. Furthermore, the webinar presents the possibilities and limits of failure detection in many examples.

  • Sample inspection vs. 100% x-ray inspection - technical and economic comparison
  • X-ray inspection (AXI) compared to the automatic optical inspection (AOI)
  • Possibilities and limitations of the failure detection of an AXI system
  • Practical example for the 100% X-ray inspection of an PCB

Date
25 April 2017

Time
2 PM EDT (11 AM PDT)

Speaker
David Whetstone, GOEPEL electronics LLC

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Facts Webinar: Why only sample if a 100% x-ray inspection is possible?
25 Apr 2017 14:00 15:00
Organizer
Frank Amm
Frank Amm
+49-3641-6896-741 Fon
+49-3641-6894-945 Fax