AXI Systems - X-Ray inspection of hidden solder joints - GOEPEL electronics

OptiCon X-Line 3D - automatic x-ray inspection (AXI)

X-Line 3D X-Ray system

3D in-line X-ray inspection system for maximum fault coverage using digital tomosynthesis with outstanding inspection speed.

Real-time 3D detector concept with maintenance-free micro focus X-ray tube that allows simultaneous image capturing from different angles.

Reconstruction processes possible due to tomosynthesis
Simultaneous inspection of top and bottom side of a double sided PCB
Parallelization of PCB loading, unloading and test all simultaneously - reduction of the PCB handling time to 5 s

Optimal adaptation to future components and manufacturing requirements via Software XI-PILOT
Algorithm library suitable for all common components
Modular concept - configuration options for 2D and 3D systems as well as different levels of inspection speed

X-ray tube Voltage Current	Maintenance-free, sealed micro focus X-ray tube max. 130 kV max. 300 µA

Detector Gray-scale resolution Spatial resolution Angled view Inspection speed 3D / 2D	GOEPEL Real-time multi-angle detector 12 Bit Variable from 10 µm/Pixel to 35 µm/Pixel 0° to 45° 40 cm²/s with 15 µm/Pixel resolution

X-ray safety	Completely shielded system according to "Röntgenverordnung"

PCB handling Maximum PCB size PCB thickness Clearance top side Clearance bottom side Maximum PCB weight	3 segments, shielded 460 mm x 400 mm 0.5 mm bis 5 mm 40 mm 65 mm 5 kg

Miscellaneous In-line interface Electrical requirements Compressed air Dimensions Weight	SMEMA, SIEMENS 1,560 mm (width) x 1,540 mm (depth) x 1,470 mm (height, basic system)/ 1,720 mm (height, tube tower) approx. 2,500 kg

GOEPEL electronics Ltd., Unit 1A, The Old Granary, Westwick, Cambridge, CB24 3AR
Phone +44-1223-858298, Fax +44-1223-257800, www.goepel.co.uk