AXI System OptiCon X-Line 3D upgraded by double-sided AOI Inspection
 |  AXI System OptiCon X-Line 3D |
GOEPEL electronics now offers an option to integrate double-sided Automated Optical Inspection into its AXI system OptiCon X-Line 3D. This removes the Achilles heal of AXI, no optical test possible, e.g. for the inspection of polarities, colours or barcodes, and, consequently, increases the coverage of optically detectable faults to nearly 100%.
The AOI module integration into OptiCon X-Line 3D enables a non-stop image capturing of the board top and bottom side parallel to the X-ray inspection without test speed limitations. The AOI option allows a colour image capturing at a resolution of 20µm. The module can be integrated optionally for testing either top or bottom side, or the double-sided inspection of the PCB.
In terms of speed, the OptiCon X-Line 3D is a worldwide unrivalled AXI system because of the utilisation of the revolutionary GigaPixel technology. A real-time multi angle image recording is the basis that enables a test speed of 40cm²/s at full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of the board’s single layers. Therefore during test of double-sided PCBs, upper and lower side can be inspected separately within the same process run. For maximum fault coverage of BGA components, it is possible to analyse solder joints on various levels and to determine the wetting state. Of course, solder joints on IC pins and 2-pin components, as well as the presence of voids can be detected with OptiCon X-Line 3D.
The system’s modular concept enables configuration models for 2D and 3D systems with various test speeds.
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