http://www.goepel.com/ GOEPEL electronics is a world class vendor of JTAG/Boundary Scan, Automated Inspection Systems and Automotive Test Solutions. en http://www.goepel.com/fileadmin/templates/goepel-template/Images/goepel-icon-iphone.png http://www.goepel.com/ 60 60 GOEPEL electronics is a world class vendor of JTAG/Boundary Scan, Automated Inspection Systems and Automotive Test Solutions. TYPO3 - get.content.right http://blogs.law.harvard.edu/tech/rss Mon, 14 May 2012 14:09:00 +0200 http://www.goepel.com/en/news/newsdetails/article////neue-3d-roentgensystemsoftware-opticon-xi-pilot-30.html GOEPEL electronic introduces the new x-ray inspection system software OptiCon XI-Pilot 3.0. Spacial Correction of PCB Deflection with OptiCon X-Line 3D A true to height reconstruction of PCB layers in which solder joints are situated is a prerequisite for solder joint analyses. A 3D x-ray inspection (AXI) system must detect and compensate for PCB warpage or waved surfaces because such situation may lead to false calls or even escape. GOEPEL electronic GmbH utilises a purpose developed method, which detects and compensates PCB slag during the inspection process. The result is a true to height solder layer reconstruction for a high-quality evaluation of solder joints. Based on PCB condition it is possible to select whether the entire assembly or each partial circuit of a value should be compensated. For PCB warpage determination, a laser triangulation sensor can be applied. It is also possible to compensate for PCB slag directly in the recorded images per software algorithmic. Automatic Stability Monitoring of X-ray Image Sequence An x-ray inspection system image sequence generally consists of a source for x-ray emission and a detector to convert radiation weakened by the UUT into visible light. Natural ageing processes of these components change grey values in the x-ray images, which may lead to faults in algorithmic evaluation of solder joints. The AXI system OptiCon X-Line 3D automatically detects changes in the x-ray image chain and re-calibrates the images chain at lower deviations of the acceptable tolerances. Thus, it is possible to guarantee constant image quality and measurement values in the system during the inspection process. It ensures that image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.]]> Company Automated Inspection (AOI/AXI) press@goepel.com Thu, 10 May 2012 08:21:00 +0200 http://www.goepel.com/en/news/newsdetails/article////erhoehte-effektivitaet-zur-pruefung-von-tht-baugruppen-im-inline-prozess.html GOEPEL electronic presents its enhanced AOI system OptiCon THT-Line for integration in THT... OptiCon THT-Line for integration in THT production lines. The inspection system ready for manual loading can now be directly integrated in the production flow of PCBs with through-hole technology. From now on, carriers sized up to 620 mm x 510 mm can be fed into the system, whereby the AOI modules inspection area allows the test of PCBs up to 540 mm x 410 mm dimensions at a component height up to 80 mm. Depending on production organisation, carriers with or without assemblies can be returned in the lower part of the AOI system.   The OptiCon THT-Line features the latest system software version OptiCon PILOT 5.2. It supports the inspection of THT assemblies by particularly convenient opportunities for test program generation by means of “easyELKO” and “easyOCR”. These functions allow for polarity check of electrolytic capacitors as well as label reading without prior pre-learning process. Compared to already known character recognition methods, this means a revolutionary step in OCR utilisation for quality control of electronic assemblies. Additionally, the available touchscreen operation with optimised user interface provides a convenient and efficient working method with the system.]]> Automated Inspection (AOI/AXI) Company press@goepel.com Wed, 09 May 2012 11:10:00 +0200 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-erweitert-produktportfolio-um-neue-generation-in-line-on-board-programmer.html GOEPEL electronic introduced RAPIDO™, a new family of multi-site in-line programmers. RAPIDO™, a new family of multi-site in-line programmers designed for high-speed in-system programming (ISP) of non-volatile memory devices such as Flash, serial EEPROM, micro controller units (MCU), and programmable logic devices (PLD). RAPIDO is based on the award-winning SCANFLEX^® architecture and supports the latest embedded system access (ESA) technologies. With its patented mechanics the scaleable solution offers flexible handling and high throughput for production applications. As a result, RAPIDO provides opportunities to significantly reduce inventory management / version control costs and overall manufacturing costs.     “With our philosophy of embedded system access we are addressing not only issues related to accessibility and complexity of test, but also those related to device programming.  Our new RAPIDO product line brings the benefits and potential of ESA technologies to high-volume production”, says Thomas Wenzel, GOEPEL electronic’s Managing Director for the company’s Boundary Scan Division. “Almost every other project is a mix of test and device programming, and due to RAPIDO’s compatibility with other SYSTEM CASCON™ configurations users can directly reuse test and programming routines. As a result, extensive debugging can be avoided and target-specific programmer licenses are not required with RAPIDO”. The first member of the RAPIDO product family, RPS900-S16, provides double-sided probing with up to 900 nail probes and gang programming of up to 16 sites. Supporting all ISP technologies based on embedded system access, available applications include FPGA-assisted programming (FAP), core-assisted programming (CAP) through a JTAG or non-JTAG debug interface of a processor, in-application programming (IAP), and programming via Boundary Scan. Targets for RAPIDO programming applications are all types of Flash devices, such as NOR, NAND, and eMMC with parallel or serial interface, as well as on-chip memory on micro-controllers and all kinds of PLD and FPGA devices. In the case of Flash accessible through edge connectors or probe points, direct programming through nail probes is possible as well, utilizing RAPIDO’s dynamic I/O resources. Core elements of RAPIDO are the proven and mature software and hardware platforms SYSTEM CASCON and SCANFLEX, respectively. In addition, various options can be added to the system configuration in order to incorporate board test applications, to accommodate customer specific extensions, to program through CAN, LIN, or FlexRay interfaces, and for communication with pick-and-place feeders and with PASS/FAIL sorters, for example. Sales and support for RAPIDO is available worldwide through GOEPEL electronic’s established network of branch offices and selected partners. Service includes delivery, installation, and maintenance of complete preconfigured turn-key solutions.]]> Company Boundary Scan press@goepel.com Mon, 14 May 2012 14:09:00 +0200 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-stellt-neues-system-zur-3d-lotpasteninspektion-vor.html GOEPEL electronic introduces a brand-new system for 3D solder paste inspection (SPI). OptiCon SPI-Line 3D provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection.   The new SPI system will be offered in three different configurations determined by pixel resolutions of 10 µm, 15 µm and 20 µm. An inspection speed of up to 90cm² can be achived. The OptiCon SPI-Line 3D is fully compliant to all OptiCon AOI systems from GOEPEL electronic, allowing for hitherto unknown opportunities in PCB production process optimization. Core element is a specifically developed 3D camera head functionally based on the fringe projection principle, operating without moving parts. In connection with a newly designed drive system for assemblies and measuring head a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed. The completely new developed user interface SPI-Pilot provides an efficient, reliable and simple programming. An offline programming station and a module for statistic process control (SPC) evaluation are offered as add-on options.]]> Automated Inspection (AOI/AXI) press@goepel.com Tue, 08 May 2012 12:39:00 +0200 http://www.goepel.com/en/news/newsdetails/article////aoi-systeme-der-opticon-serie-neuerungen-in-allen-dimensionen.html At this year’s SMT/Hybrid/Packaging in Nuremberg/Germany GOEPEL electronic GmbH presents a wide... wide range of innovations in all of its AOI systems. In addition to the stand-alone system OptiCon BasicLine all inline system variants such as OptiCon AdvancedLine, OptiCon TurboLine as well as the recently awarded OptiCon THT-Line are exhibited. All systems feature the new software version OptiCon PILOT 5.2, characterised by numerous new functions.   The improved ease of use during program generation and optimization is one of the key features. Now components on PCBs can be automatically identified and assigned for CAD data import. Measured values of several PCBs can be logged to efficiently adapt generated test programs to manufacturing deviations, whereby limiting values are defined on a wide statistic basis. Benefits are reduced debug efforts and an even faster inspection program utilisation in the production process.  All AOI systems are now equipped with touchscreen displays providing an optimized user interface for comfortable and efficient operations. Additional inspection functions based on laser height measurement enable the detection of 3D profiles, e.g. at THT connectors or other components. In parallel, shadow projection methods as time saving measurement opportunities in the third dimension are now available.]]> Automated Inspection (AOI/AXI) Company press@goepel.com Tue, 08 May 2012 11:29:00 +0200 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-verbessert-flexibilitaet-von-jtag-io-modulen-durch-fpga-embedded-instruments.html GOEPEL electronic introduces ChipVORX Module, a special FPGA based I/O module product range. ® Germany, GOEPEL electronic introduces ChipVORX^® Module™, a special FPGA based I/O module product range. The new modules are controlled via a standard TAP enabling the opening of the entire ChipVORX^® eco system of test and programming IPs for external instrumentation. “Our ChipVORX technology has developed into the leading method of JTAG controlled FPGA embedded instrumentation within the last two years. With our new I/O modules users will be able to port high flexibility and performance directly to external infrastructures”, says Thomas Wenzel, GOEPEL electronics’ Boundary Scan Divisions managing director.  “The dual usability of existing ChipVORX IP enables a complete synergy with embedded unit under test applications. Furthermore, existing systems can be simply extended organically.” The first ChipVORX^® module named FXT-X90 is based on a Xilinx FPGA, providing 90 I/O channels, whereby 72 are voltage programmable. Being equipped with transparent TAP, the module enables the cascading of several boards of the same or different types due to the daisy-chain principle. Various functions for universal frequency measurement, RAM test, and fast Flash programming or control customer-specific instruments are provided as ChipVORX^® IP. Among others, the module provides a separate clock generator. As another unique feature, the ChipVORX^®-IP does not require specific design synthesis, i.e. they are ideally suit for adaptive debugging. In addition to FPGA embedded instrument utilization, FXT-X90 can be applied as simple Boundary Scan I/O module with dynamic mode switch opportunity. The new hardware modules are supported in all SCANFLEX^® Boundary Scan controllers as well as the integrated software platform SYSTEM CASCON™. For over 20 years, SYSTEM CASCON™ has been the most innovative integrated JTAG/Boundary Scan development environment, hitherto providing 47 integrated ISP, debug and test tools for design validation, production test, and field service. User can comfortably integrate the FXT-X90 ChipVORX^® Module™ in a respective test object, generate all required test and programming vectors fully automatically, and if necessary interactively debug and visualize faults at pin and net level in the schematic. The usage of the ChipVORX®-IP does neither require expert background knowledge nor specific FPGA tools or programmer. Prospectively, the ChipVORX I/O Module model range will be extended to additional Xilinx chips as well as further FPGA vendors.]]> Boundary Scan press@goepel.com Fri, 04 May 2012 11:29:00 +0200 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-erschliesst-neue-dimensionen.html New 3D Inspection and Test Solutions at SMT 2012 SMT/Hybrid/Packaging in Nuremberg/Germany. The trade show will be used to introduce additional world premiere solutions. At stand 410 in hall 6 the German Company will exhibit Automated Optical Inspection (AOI) systems with integrated 3D metrology. The AOI systems feature adaptive 3D technologies enabling maximum fault detection by means of precise height measurement as well multidirectional image capturing. Additionally, GOEPEL electronic’s OptiCon THT-Line will be presented as an inline solution, approaching new dimensions in integrating advanced AOI systems in the THT production process. A completely new solution for PCB solder paste inspection (SPI) will be the brand-new OptiCon SPI-Line 3D. Core element is a specifically developed 3D camera head functionally based on the fringe projection principle. In connection with a newly designed drive system for assemblies and measuring head a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed. In the field of Automated X-ray Inspection (AXI) GOEPEL electronic will demonstrate the worldwide unrivalled high inspection speed of its OptiCon X-Line 3D system, designed to be fully integrated into the production line environment. In addition to a newly developed automatic x-ray image chain stability control, the system software XI-Pilot version 3.0 will be introduced. It contains new features for automatic PCB deflection check and supports the ExtendedDynamicTechnology™ for even more detailed images. The multi dimensionality of GOEPEL electronic’s JTAG/Boundary Scan solutions were recently emphasized by the introduction of “Embedded System Access” (ESA) technologies and consequently extension of application opportunities. Alongside software solutions for, among others utilisations for multi-chip modules, 3D chips or multi-board applications, as market leader GOEPEL electronics’ will introduce its completely new, inline programming system named RAPIDO. This extremely powerful on-board programmer is based on the well-established and severally awarded SCANFLEX™ architecture and heralds GOEPEL electronics’ entry into a totally new market segment.]]> Company Automated Inspection (AOI/AXI) Boundary Scan press@goepel.com Tue, 17 Apr 2012 09:20:00 +0200 http://www.goepel.com/en/news/newsdetails/article////boundary-scan-branchentreffen-im-zeichen-der-embedded-system-access-technologien.html GÖPEL electronic lädt zu den 12. Boundary Scan Days® ein. Boundary Scan Days^® in Jena. Das diesjährige Interessenten- und Anwendertreffen zum Thema JTAG/Boundary Scan steht im Zeichen des Paradigmenwechsels bezüglich zukünftiger Test- und Programmierstrategien. Embedded System Access (ESA) Technologien und deren aktuelle wie zukünftige Einsatzmöglichkeiten bilden Rahmen der Veranstaltung, zu deren Anlass der 20. Geburtstag der Boundary Scan Software-Suite SYSTEM CASCON™ aus dem Haus GÖPEL electronic begangen wird. Während der Boundary Scan Days^® werden Nutzer und Entwickler Vorträge über Anwendungen, neue Technologien, Standards and technologische Trends halten. Vertreter von Firmen aus den Bereichen Industrieelektronik, Mess- und Prüftechnik, Luft- und Raumfahrt, Automotive, Medizintechnik und Kommunikationselektronik berichten über Applikationen, Problemlösungen und spezielle Einsatzfälle und geben ihre Erfahrungen sowie den Nutzwert durch JTAG/Boundary Scan an Interessenten und andere Anwender weitergeben.  Eine wichtige Säule der Boundary Scan Days^® bilden die Workshops, die von den Gästen je nach Interessenlage besucht werden können. Auch hier sind die Themen von In-System Emulation, Chip-embedded Instrumentierungen über Programmieraufgaben und Integrationsmöglichkeiten bis hin zu effektiven JTAG/Boundary Scan Projektentwicklungen breit gefächert. „GÖPEL electronic bietet mit SYSTEM CASCON nicht nur seit 20 Jahren die leistungsstärkste Boundary-Scan-Software am Markt an, sondern hat immer wieder mit neuen Strategien und Lösungsansätzen für eine Weiterentwicklung und Belebung der Boundary-Scan-Technologie sowohl im Soft- wie im Hardware-Bereich gesorgt“, erklärt Stefan Meißner, Pressesprecher bei GÖPEL electronic. „Dabei konnten wir eine Vielzahl interessanter und anspruchsvoller Projekte umsetzen. Deren Vorstellung sowie die zukünftige Ausrichtung des elektrischen Testens und Programmierens mittels Boundary Scan sind zentrale Bestandteile der diesjährigen Veranstaltung.“ Die Boundary Scan Days^® von GÖPEL electronic bieten schon seit einem Dutzend Jahren eine Plattform des persönlichen Erfahrungsaustauschs, der Erkenntnisgewinnung und der Diskussion zukünftiger Anwendungen – mittlerweile zählen sie zu diesem Fachthema als führende Technologieveranstaltung in Deutschland. Traditionell nutzt GÖPEL electronic das Event auch zur Vorstellung einer weiteren strategisch wichtigen Innovation: der Markteinführung von sogenannten ChipVORX(R) Modulen. Dabei handelt es sich um FPGA zentrische I/O Module mit einem standardisierten IEEE1149.1 Interface zum Einsatz von FPGA Embedded Instruments auf Basis von ChipVORX IP. Interessenten können sich bei Frau Claudia Mock per E-Mail unter c.mock@goepel.com, telefonisch unter der 03641-6896-763 oder online zu den Boundary Scan Days^® anmelden.]]> Boundary Scan presse@goepel.com Wed, 28 Mar 2012 15:30:00 +0200 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-beschleunigt-boundary-scan-projektentwicklung-fuer-multi-board-applikationen.html GOEPEL electronic announces the availability of a new Board Merger. Boundary Scan press@goepel.com Tue, 13 Mar 2012 06:42:00 +0100 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-forciert-einsatz-von-prozessor-emulation-in-kombination-mit-in-circuit-test.html GOEPEL electronic introduces TIC022, a TAP Interface Card (TIC). TIC022, a TAP Interface Card (TIC) for the Boundary Scan hardware platform SCANFLEX^®. The new TIC Module features a programmable multi bus interface enabling a nearly unlimited compatibility to a multitude of standardised and proprietary microprocessor debug protocols.  The new TIC022 module can be integrated in application critical environments such as In-Circuit Test (ICT) fixtures. “We are convinced that intrusive methods will play a critical role in the production test in the next few years. That’s why our strategy is focused on accompanying the paradigm change towards Embedded System Access technologies especially by respective important migration solutions for In-Circuit tester, such as our new TIC hardware”, explains Karl Miles, UK Sales Manager with GOEPEL electronics UK. “We smooth the way for the advanced use of Core Assisted Flash Programming and Processor Emulation Test as functional at-speed test. In principle, our solution provides even higher test coverage by means of the interaction with the ICT probes.” TIC022 is an active test head specifically developed for in-fixture utilisation with the adaptive streaming technology VarioTAP^®. In addition to bus signals, it provides a number of emulation signals that can flexibly be integrated in a streaming procedure. Thus, TIC022 is able to cover various protocols and target interfaces, including standards such as IEEE1149.1, IEEE1149.6, IEEE1149.7, IEEE1532 and IEEE-ISTO 5001 as well as numerous non-JTAG interfaces like BDM (Background Debug Mode) from Freescale^®, SBW (Spy-Bi-Wire) from Texas Instruments^®, SWD (Serial Wire Debug) from ARM^® and many more. The test head’s differential coupling with a SCANFLEX^® TAP Transceivers located outside the fixture enables interference-free high-speed data transfers of up to 80 MHz over distances of more than four meters.  There is no performance loss as runtime delays in the cables and units under test (UUT) can be individually compensated per TAP through the ADYCS™ technique.   This new member of the family of TIC modules features the same differential interface as the existing standard module type TIC02, allowing existing applications to be easily upgraded, protecting prior investments. Automatically recognised by the AutoDetect feature, TIC022 is supported in the industry leading JTAG/Boundary Scan software SYSTEM CASCON™. Through OEM cooperation with all leading vendors of In-Circuit testers (ICT), Manufacturing Defect Analysers (MDA), Flying Probers (FPT) and Functional Test systems (FCT), the new solution is available immediately for production test applications.]]> Boundary Scan Hardware press@goepel.com Thu, 08 Mar 2012 11:00:00 +0100 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-erweitert-chipvorx-zur-ultraschnellen-programmierung-von-fpga-boot-flash.html GOEPEL electronic announced the development of an additional ChipVORX model library series for... ChipVORX^® model library series for accelerated in-system programming (ISP) of FPGA Boot Flash components. The ChipVORX^® models developed in cooperation with the Tallinn/Estland based Company Testonica are structured modularly as intelligent IP. They enable the ultra-fast parallel programming of every kind of FPGA Boot Flash components at full workflow automation. “Modern system developments are increasingly based on the utilisation of powerful FPGA platforms and require for efficient solutions in in-system programming of the necessary Boot Flash in particular in the production process. Our new ChipVORX models continue to achive these demands”, says Thomas Wenzel, GOEPEL electronic’s managing director of the Boundary Scan Division. “The combination of highest performance, automation and synthesis freedom enables users to implement highly efficient programming strategies. At the same time, ChipVORX becomes the most flexible technology in controlling FPGA embedded instruments by far.” Due to the complete integration of the ChipVORX^® IP the recognition of the structural connections between Flash target and FPGA is done as automatically as the succeeding script file generation. The programming is based on a standardised IEEE1149.1 TAP (Test Access Port) and can be executed on each run time station without further options. Thereby, parallel programming on one board and Gang applications are naturally supported. Because of the ChipVORX^® IP’s independence of the target to be programmed the Flash type imposes no restrictions. As the same system libraries as for a “normal” Boundary Scan programming are used, users may update new Flash models by themselves.    In practice, the ChipVORX^® IPs can achieve dramatic speed improvements compared to standard Boundary Scan programming procedures. For example, a 128 Mbit Flash can be programmed within 48 seconds only be limited by the Flash internal programming speed. Utilising the available 16 fold Gang options for mass production the programming time is reduced to 3 seconds. At the moment, the ChipVORX^® models for Flash programming are available for all Altera and Xilinx FPGA families; additional ones are under development.  The usage of the IP does neither require expert background knowledge nor special FPGA tools or programmers. Due to the OEM cooperation with all leading vendors of In-Circuit Testers (ICT), Manufacturing Defect Analysers (MDA), Flying Probe Testers (FPT) and Functionality Testers (FT), the new solution is available for production with immediate effect. The new ChipVORX^® IP models are supported as standard starting from SYSTEM CASCON™ version 4.6.1 and are activated by the licence manager like the system software. SYSTEM CASCON™ is a professional JTAG/Boundary Scan development environment, developed by GOEPEL electronic with currently 47 completely integrated ISP, test, and debug tools. Regarding the hardware, VarioTAP^® is completely supported by the controllers of the SCANBOOSTER™ family, as well as by the hardware platform SCANFLEX^®.]]> Boundary Scan press@goepel.com Thu, 01 Mar 2012 08:58:00 +0100 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-demonstriert-erstes-evaluierungskit-fuer-embedded-system-access.html GOEPEL electronic introduces ESA Coach, a special evaluation and training kit supporting Embedded... ESA Coach, a special evaluation and training kit supporting Embedded System Access (ESA) technologies.   The new demonstration board enables the practical training of all Embedded System Access technologies such as Boundary Scan, Processor Emulation Test and Chip Embedded Instruments by means of respective tutorials, additionally allowing for the development and validation of individual Intellectual Properties (IP). “The advancing paradigm change from intrusive test to Embedded System Access requires corresponding knowledge and technology transfer, which we are able to excellently support by our new ESA Coach”, says Jan Heiber,  Application Support Manager with GOEPEL electronic’s Boundary Scan Division. “Practically training newest test and programming strategies enables users to solve access problems caused by intrusive methods. Simultaneously, users receive a lot of suggestions for process improvements throughout the entire product life cycle, and for holistic approaches to reduce costs.” In addition to a microcontroller with ARM core, the ESA Coach includes an FPGA, various Boundary Scan circuits, NAND and NOR Flash, DDR2-SDRAM as well as a colour display and diverse operating elements. All ESA technologies such as FPGA Assisted Test, FPGA Assisted Programming, Processor Emulation Test, Core Assisted Programming, Boundary Scan, In-System Programming and Chip Embedded Instruments can be demonstrated and compared due to their performance. Furthermore, the demonstration board provides an extension connector and various fault switches in order to verify the single test operations’ diagnosis ability. The Kit also contains a demo version of SYSTEM CASCON Release 4.6 as well as associated VarioTAP^® and ChipVORX^® models for Processor Emulation or controlling FPGA Embedded Instruments. SYSTEM CASCON™ is a professional JTAG/Boundary Scan development environment, developed by GOEPEL electronic with currently 47 completely integrated ISP, test, and debug tools for design validation, production test and field service. It features the technologies ChipVORX® to control Chip Embedded Instruments and VarioTAP® for Processor Emulation.]]> Boundary Scan presse@goepel.com Wed, 29 Feb 2012 07:34:00 +0100 http://www.goepel.com/en/news/newsdetails/article////weltweit-einziger-pxi-controller-fuer-most150.html GOEPEL electronic introduces PXI 6161, currently the only worldwide PXI communication controller... PXI 6161, currently the only worldwide PXI communication controller supporting MOST150 standard. Software and hardware are offered on a single-source basis allowing users the flexible configuration required for their individual requirements. A Break out Module as an optional accessory facilitates the connection of additional resources such as the Electronic Control Line (ECL) or trigger lines. In addition to the PXI version, GOEPEL electronic offers the module as USB variant. The card’s intelligent PowerPC architecture allows the access to two on the board integrated network interface controllers (INIC OS81110), to ensure the MOST internal communication as well as monitoring of MOST contents. PXI 6161 has been optimized for applications in the end-of-line area (e.g. screening, validation), offering numerous functionalities to implement various test scenarios. As many MOST networks as required can be generated by utilizing several modules in a PXI system One module can be configured as Master, Slave or Spy, allowing for any facets of ECL, which can be actively initiated or passively responded.  For multibus applications, there are two configurable interfaces being able to send and process CAN and LIN messages in parallel to the MOST communication. The standard Ethernet interface allows the routing of MOST information on the MOST Ethernet channel. Simultaneously, an add-on board provides the usage of DVI or S/PDIF signals for multimedia applications. The interaction between modular hardware and powerful software allows the controller’s parameterization via the Windows standard API from GOEPEL electronic. Supported by an onboard API, users may install and execute self-generated program codes on the module. Users of GOEPEL electronics’ test sequencer software benefit from various communication and verification routines for automated quality checks.]]> Automotive Test Solutions press@goepel.com Wed, 29 Feb 2012 07:10:00 +0100 http://www.goepel.com/en/news/newsdetails/article////goepel-electronic-richtet-boundary-scan-plattform-auf-embedded-system-access-technologien-aus.html GOEPEL electronic demonstrates the series version 4.6 of its Boundary Scan software platform SYSTEM... ®. The solution’s necessary openness is achieved by an independent model library for component description, processor IP and FPGA IP. It consistently follows the principle of software reconfigurable instrumentation up to hardware level. SYSTEM CASCON™ is a professional JTAG/Boundary Scan development environment, developed by GOEPEL electronic with currently 47 completely integrated ISP, test, and debug tools for design validation, production test as well as field service. Regarding the hardware, SYSTEM CASCON™ is ideally supported by several controllers such as PicoTAP, elements of the SCANBOOSTER™ family, as well as by the hardware platform SCANFLEX^®. The shipping of SYSTEM CASCON™ 4.6 has already started, being free-of-charge for customers with valid maintenance contract.]]> Boundary Scan Software press@goepel.com Tue, 28 Feb 2012 09:31:00 +0100 http://www.goepel.com/en/news/newsdetails/article////neue-generation-testsysteme-fuer-netzwerkeigenschaften-von-steuergeraeten.html The new generation of the TESSY series from GOEPEL electronic. new generation of the TESSY series from GOEPEL electronic, a test system family for network characteristics of electronic control units (ECUs), features optimised hardware architecture and significantly extended range of functions. The most newsworthy feature of the new family is the support of the FlexRay bus for communication behaviour test of ECUs, which adds to the already available bus families of CAN, LIN and K-Line. In terms of hardware the FlexRay option is based on the FlexRay controller from the series 61 as well as on the FlexScope^® technology from GOEPEL electronic. The following range of tasks can be mastered: signal-based remaining bus simulation, measuring of timings within and between communication messages, analysis of data traffic, tracing of bus synchronisation and error simulation. Measurement capabilities for testing the physical layer have been significantly improved by using a higher-performance four-channel oscilloscope and signal-based trigger options at the message level. Determination of the sampling point in time is performed according to a proprietary method patented by GOEPEL electronic, and has been extended to 1 Mbaud. The capability of measuring the sampling point in time now on the LIN bus is among the very highlights and unique selling propositions of the new tester generation. Due to increased flexibility of the system’s relay matrix, the system can route a significantly greater number of measurement and stimuli resources. Mainly the generation of internal CAN and LIN networks for simulation tasks will benefit from these enhancements. Inline with the tendency that more and more control units can’t be tested without the original peripherals (e.g. actuators) being connected, the current carrying capacity of terminal 30 (supply) has been increased to 40 amps. A completely new testing horizon has been opened up through integration of so-called CAN hub modules into the test system. They provide multiplexing of the CAN bus using a proprietary method which has been registered for patent approval. The CAN hub modules use parameterisable filters to include additional control units or external CAN networks (e.g. breadboards or laboratory vehicles) into the experimental setup. Furthermore they enable parallel testing of several identical control units in a multiplex operation. This will help to take optimal advantage of the test system for endurance tests, as longer tester runs (e.g. overnight or during the weekend) are possible without the need of manual exchanging UUTs. Last but not least, the use of the new modules will lead to a significant cost saving when setting-up the test systems.]]> Automotive Test Solutions press@goepel.com Mon, 27 Feb 2012 15:46:00 +0100 http://www.goepel.com/en/news/newsdetails/article////neues-inspektionsmodul-zur-selektiven-tht-loetstellenkontrolle.html GOEPEL electronic introduces TOM Selective-Line, a cost-effective module for selective THT solder... TOM Selective-Line™, a cost-effective module for selective THT solder joint inspection. The powerful and easy-to-integrate module can be utilized for offline as well as inline applications. The innovative combination of modular illumination, telecentric lens and intuitive software enables a high quality and reproducible evaluation of THT solder joints according to IPC-A-610. Various illumination variants guarantee a perfect contrast also for changing PCB colours. Possible negative impacts of fluxes or solder masks are eliminated by precisely controlled segment by segment side lighting. The telecentric lens enables a distortion-free, sharp image of the PCB, whereby the module to inspect larger fields of view (standard: 48mm X 48mm) can be moved pneumatically or electronically utilising an X&Y axis system. The easy-to-use proven TOM Line image processing software offers special functions,  for evaluation of solder joints, shorts or solder splashes. The software can be remote controlled via Ethernet, RS232 or Digital I/O, offering a multitude of functions for safe detection of THT soldering defects on printed electronic assemblies. ]]> Industrial Vision Solutions press@goepel.com Fri, 24 Feb 2012 09:06:00 +0100 http://www.goepel.com/en/news/newsdetails/article////weltweit-bestes-boundary-scan-produkt.html GOEPEL electronic receives international “Best in Test Award 2012” for Gang Test and Programming... Best in Test Award”, assigned by the international publication and website “Test & Measurement World”. Nominated for the category “Design for Test/Boundary Scan” GOEPEL electronic’s Boundary Scan test and programming solution SFX/TAP16-G continues to win against hard competition. “Our software and hardware solutions have been representing the technological pinnacle in JTAG/Boundary Scan, demonstrated by the repeated awards”, says Stefan Meissner, GOEPEL electronic’s Public Relations Manager. “Receiving the ‘Best in Test Award’ for our SFX-TAP16/G also indicates the increased importance of programming solutions by means of Boundary Scan. Additionally, the extraordinary achievements our engineers have made in developments for a demanding market year after year have been consecutively honoured.” The “Best in Test Awards” are the internationally most wanted and respected industry prizes, and numerous companies and their products compete for this award each year. The SFX-TAP16/G is the worldwide first completely modular Gang test system with integrated UUT power supply. It can be applied to test or program up to 16 boards in parallel without any additional hardware. Based on an innovative architecture, highly compact and cost-efficient Gang test applications can be implemented. The system utilisation increases efficiency in the production at significantly reduced manufacturing costs.]]> Boundary Scan Company press@goepepl.com Fri, 10 Feb 2012 07:44:00 +0100 http://www.goepel.com/en/news/newsdetails/article////neue-sphaeren-embedded-system-access-und-buskommunikation.html At this year’s Embedded World trade show GOEPEL electronic will introduce a revolutionary strategic... Embedded System Access” (ESA) the Company will introduce a completely new class of technologies for JTAG/Boundary Scan, chip embedded instruments, in-system programming or processor emulation tests. A multitude of innovative technologies such as VarioTAP^® and ChipVORX^® support new dimensions in accessing components and assemblies, e.g. for Processor Assisted Programming and Test, FPGA Assisted Programming and Test or future standards like IJTAG and SJTAG. This paradigm shift is GOEPEL electronic’s response to changing requirements to test and programming strategies as well as reduced electronic and intrusive access. Furthermore, on stand 302 in hall 4 GOEPEL electronic will display new software and hardware solutions for ECU test and bus communication to electronic vehicle components: Net2Run is the currently most powerful software suite for easy configuration and data administration utilising the communication controller Series 61 for CAN, LIN and FlexRay as well as testbus simulation. Additionally, GOEPEL electronic presents PXI 6161, at present the worldwide only PXI interface module supporting MOST150 standard. Numerous PXI, USB and Ethernet controllers for various applications in Automotive Test round off the Company’s show appearance.]]> Boundary Scan Company Automotive Test Solutions press@goepel.com Wed, 08 Feb 2012 09:04:00 +0100 http://www.goepel.com/en/news/newsdetails/article////asien-vertrieb-von-axi-systemen-forciert.html GÖPEL electronic and nanoX Technology enter Partnership nanoX Technology Pte. Ltd. have entered into a strategic partnership to distribute systems for Automated X-ray Inspection (AXI). Since December 2011, the Singapore based Company has been responsible for sales and support of GOEPEL electronic’s AXI system OptiCon X-Line 3D in the Asian-Pacific area. “In GOEPEL electronic we found a qualified partner offering an outstanding solution for automated 3D inline x-ray inspection”, says Michael Soeding, CEO of nanoX Technology. “Now we are able to provide our own 3D offline solutions and complementary 3D inline x-ray inspection systems both being supported by our team of technical experts.” “In cooperation with nanoX Technology we are advancing on the path towards introducing our Automated X-ray inspection system OptiCon X-Line 3D in Asia”, adds Alice Goepel, GOEPEL electronic’s International Sales Manager AOI/AXI-Systems. “Based on long-time experiences on the field of 3D x-ray inspection technology and its well-established network of 24 offices and 50 application engineers we have a competent partner on our side.” In terms of speed and detection safety, the OptiCon X-Line 3D is a worldwide unrivalled AXI system because of the utilisation of the revolutionary GigaPixel technology. A real-time multi angle image recording is the basis that enables a test speed of 40cm²/s at full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of the board’s single layers.]]> Automated Inspection (AOI/AXI) press@goepel.com Fri, 03 Feb 2012 13:31:00 +0100 http://www.goepel.com/en/news/newsdetails/article////neue-generation-des-canlin-handbedienterminals-fuer-den-automotive-fertigungsbereich.html GOEPEL electronic presents revised version of smartCommander. new generation of the CAN/LIN handheld terminal smartCommander, GOEPEL electronic provides a powerful, practice-oriented device, whose mechanical robustness has been fundamentally refined. The handier enclosure now features a shock- and impact-proof rubber jacket and the internal electronics assembly is mechanically completely decoupled from the casing.   Hence, smartCommander is perfectly suited for use in harsh environments with increased requirements related to mechanical reliability as, for example, in vehicle assembly or the manufacture of mechatronic assemblies and systems. These fields often face the situation that operating functions must be executed at units to be mounted in vehicles without availability of related ECUs and control elements. Examples for such applications are e.g. the installation of window lifter systems in vehicle doors, sunroofs for convertible models or electrically operated tailgates. By means of the smartCommander, the communication messages of non-available control units can be simulated on the CAN or LIN bus to be able to carry out control functions, which are required for assembly processes. Without neglecting the ease of use in manufacturing areas, the new design of smartCommander focuses on highest possible flexibility. All device functions can be freely configured. To parameterise the unit, users can utilise the capable and convenient to operate software suite myCAR, which features a graphical user interface. myCAR enables the generation of CAN and LIN message sequences and supports automated generation and parameterisation of message lists from dbc or ldf data bases from the car manufacturers. The smartCommander is connected to a host PC via its USB port to program and download the ECU functions to be simulated. Message sequences, once generated under myCAR, are transmitted to the smartCommander handheld and assigned to a function key. Pushing a preprogrammed function key in standard mode results in sending the consigned message sequences via the device’s communication interfaces. smartCommander features seven freely configurable function keys, which can be independently associated with message sequences or hierarchically interlinked with each other. This means that keys can be used to change message contents initiated by another key. By default, smartCommander features one CAN and LIN interface each, which can be operated in parallel. The pluggable transceiver modules can be adjusted to the user’s specific hardware specification. Modules are available for all common LIN and CAN transceiver ICs.]]> Automotive Test Solutions press@goepel.com Wed, 01 Feb 2012 08:35:00 +0100