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Automated Optical Inspection (AOI/AXI)
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Application examples

Application examples

Integrated Power Electronics IGBT

Image provided by Indium Corporation
Image provided by Indium Corporation

Utilisation of integrated Power Electronics

  • Control components for peripheral drive modules
  • Battery charges, electric vehicles, hybrid vehicles
  • Uninterrupted power supply, emergency power generator
  • Inverter for photovoltaic, converters for wind power stations
  • Industrial drives, medical technology, illumination control
  • Railway drives

In operation, integrated power modules are exposed to high operating temperatures and power density.

The single elements´(die, ceramic substrates and heat sink) thermal coupling is implemented via large soldered areas to ensure the required high efficiency heat transfer.

Voids within these solder joints impede the heat transfer and are a critical risk for an assembly´s functionality, realibility and durability.

OptiCon X-Line 3D is an inline system, guaranteeing an efficient quality assurance based on 3D X-ray inspection with adapted image capturing and reconstruction.

Inspection Power Electronic IGBT
Inspection Power Electronic IGBT

Example 1

Example 1
Example 1
  • PCB: 216 mm x 164 mm, double-sided assembled
  • Components: 2032
  • Designs: 12x BGA, 60x SO, 1.640x Chip, 16x QFN u.a.
  • Solder joints: 7.436
  • AXI system: OptiCon X-Line 3D
  • Resolution: 11 µm / Pixel
  • Cycle time (100% comprehensive inspection): 37s (18uStandardSStp14)

Example 2

Example 2
Example 2
  • PCB: 160 mm x 100 mm, double-sided assembled
  • Components: 509
  • Designs: 6x BGA, 20x SO, 424x Chip, 12x THT u.a.
  • Solder joints: 2.977
  • AXI system: OptiCon X-Line 3D
  • Resolution: 11 µm / Pixel
  • Cycle time (100% comprehensive inspection): 34s (18uStandardSStp14)

Example 3

Example 3
Example 3
  • PCB: 290 mm x 140 mm, 20 times panelized
  • Components: 1.340
  • Designs: 20x BGA, 980x Chip, 60x QFN a.o.
  • Solder joints: 5.480
  • AXI system: OptiCon X-Line 3D
  • Resolution: 11 µm / Pixel
  • Cycle time (100% comprehensive inspection): 33s (24uHighCompClearSStp30)

Example 4

Example 4
Example 4
  • PCB: 400 mm x 230 mm, double-sided assembled
  • Components: 3.350
  • Designs: 22x BGA, 59x SO, 3.100x Chip, u.a.
  • Solder joints: 11.730
  • AXI system: OptiCon X-Line 3D
  • Resolution: 11 µm / Pixel
  • Cycle time (100% comprehensive inspection): 38s (24uHighCompClearSStp30)
GOEPEL electronics Ltd., Unit 1A, The Old Granary, Westwick, Cambridge, CB24 3AR
Phone +44-1223-858298, Fax +44-1223-257800, www.goepel.co.uk