OptiCon X-Line 3D

• Complete 3D capturing can achieve test speeds of up to 40cm²/s by revolutionary GigaPixel™ technology
• Reconstruction processes possible due to tomosynthesis
• Simultaneous 3D x-ray inspection of top and bottom side of a double sided PCB
• Optimal adaptation to future components and manufacturing requirements via Software XI-PILOT
• Algorithm library suitable for all common components
• Minimal times for test program generation

The offline programming software allows following a one-time endurance run of a PCB in the test system a complete test program generation and library adjustment at a separate PC.

• Repair station software enables a visualisation of detected faults in various forms of presentation
• Powerful analysis software allows for the inspection of single layers
• objective rating of production quality and throughput with the help of comprehensive statistical evaluation package with numerous filter settings
• Warning and action limits as well as trend analyses are definable in the SPC Module

• Layered reconstruction of components and solder joints
• Test program generation and actual inspection process are executed with geometrically calibrated, distortion free imaging of the real test objects
• Fast test program generation based on CAD data using a component library
• Predefined test algorithms and classifiers

• Full-sized 3D x-ray inspection (AXI) allows layered analysis of all solder joints of a PCB within the production process
• Safe detection of critical faults and spatial allocation of the detected defects

• Powerful analysis software provides the safe evaluation of detected faults
• Detailed examination of the inspection results in various Z-levels
• Clear representation of soldered joints and components via visualisation of selected areas

Who cares about warped surfaces?

Spacial Correction of PCB Deflection with OptiCon X-Line 3D

3D x-ray inspection systems are able to generate digital crosssection images of an assembly. In this way, double-sided equipped PCBs can be simultaneously inspected from top and bottom sides by layered solder joint separation.

A true to height reconstruction of PCB layers in which solder joints are situated is a prerequisite for solder joint analyses.

What happens if a PCB is warped or waved?

A 3D x-ray inspection system must detect and compensate for such a situation. For example, if the warp in an assembly is not compensated, evaluation algorithms check in the wrong solder layers of a component, which may lead to false calls or even escape.

GOEPEL electronic GmbH utilises a purpose developed method, which detects and compensates PCB slag during the inspection process. The result is a true to height solder layer reconstruction for a high-quality evaluation of solder joints. Based on PCB condition it is possible to select whether the entire assembly or each partial circuit of a value should be compensated.

For PCB warpage determination, a laser triangulation sensor can be applied. It is also possible to compensate for PCB slag directly in the recorded images per software algorithmic.

X-ray System monitors itself!

Automatic Stability Monitoring of X-ray Image Sequence in OptiCon X-Line 3D System

An X-ray inspection system image sequence generally consists of a source for x-ray emission and a detector to convert radiation weakened by the UUT into visible light.

Natural ageing processes of these components change grey values in the x-ray images, which may lead to faults in algorithmic evaluation of solder joints.

The AXI system OptiCon X-Line 3D automatically detects changes in the x-ray image chain and re-calibrates the images chain at lower deviations of the acceptable tolerances. Thus, it is possible to guarantee constant image quality and measurement values in the system during the inspection process. It ensures that image geometry characteristics as well as intensity (grey values) are situated in an adjustable tolerance range.