Inline AOI System for High-End Inspection in Large Scale Production
The OptiCon TurboLine AOI system’s special features are opportunities for double-sided inspection as well as various camera and illumination configurations.
It is possible to inspect the PCB bottom side without assembly turning. This is a decisive advantage over common AOI systems as inline speed is guaranteed. The rotatable angled-view and the segmented band module also help for faster inspection.
According to a repeatedly conducted customer survey, 98% of our customers gladly recommend the AOI products of GOEPEL electronic.
- Flash is required!
Unique Illumination from Infrared to Ultraviolet
PCBs must be illuminated to shed a light on the dark in an AOI system. You may select between many illumination options and variants to show and improve contrasts.
Wrongly soldered components can be clearly detected, i.e. image evaluation is getting more simple and precise.
The illumination colours in the OptiCon systems can be freely selected from infrared to ultraviolet. It is also possible to control light intensity and directions. The many light variants enable the visibility also of low-contrast components, polarity marks, differences in material and pollutions.
Automated Optical Inspection in stereoscopic view. Get a three-dimensional view on mounted PCBs.
Patented 360° Inspection in 1° Steps at constant Resolution and Definition
With our 360° inspection we check your mounted PCB all around. Resolution and definition remain constant in the entire field-of-view. Each angle of any component becomes visible, and hidden solder joints are not an issue any longer. Imaging in rotating 1° steps enable an ideal inspection for nearly all placement situations and pad geometries.
Program Optimization by means of statistically recorded Inspection Data
As factors of the daily production process, variations in the production process and component changes cannot be avoided. The software in our AOI systems provides high-performance functionalities to solve these problems efficiently.
The statistical evaluation of the single measured data enables comfortable definition of tolerances. Additionally, the integrated reference data base guarantess a stable inspection quality.
Altogether, 18 different camera configurations can be set
Rotary angled-view inspection with unique field-of-view
- Parallel side view inspection of two pin rows
- Library entree adjustments at different rotary orientations not necessary
- IPC conformal solder joint inspection
Orthogonal Top Inspection
A dual beam lense is the core element of the orthogonal camera module. If the system is equipped with two cameras, grey value and coloured image capturing of the same position is possible in different resolutions. In addition to the telecentric beam path, inspections with microscopic resolutions can be executed also with future component generations.
Orthogonal Bottom Inspection
For bottom side inspection, there are two configurations depending on speed requirements. They are characterized by telecentric beam path, enabling grey value and colour images.
Speed advantages over common AOI Systems
“Flip free”double-sided PCB inspection
The inspection of PCB top and bottom sides in one system saves additional handling modules for board flipping, reducing the cycle time for the entire PCB. According to the production process, the OptiCon TurboLine enables the inspection of assemblies of different technologies (double-sided reflow soldering, THR technology, wave or selective soldering).
Identical fields-of-view of orthogonal and angled-view cameras
Due to the orthogonal and angled-view cameras’ identical fields-of-view, the axis movement to bridge the offset between the camera modules is omitted.
The results are significant test speed benefits at increased test depth.
Load and reload during inspection by three-segment-band
OptiCon PILOT – a well-balanced Software Concept
The OptiCon PILOT software provides powerful functions for component recognition, solder joint and short inspection, OCR, colour verification as well as solder paste inspection.
In addition to the intelligent component recognition based on automated characteristic extraction from real images, the solder joint quality is determined by a complex grey value analysis using a range of illumination types.
The integrated reference database guarantees safe and documented fault detection at optimised false call rate. It enables the storage of previously detected faults and their verification after test program modifications. In case of inconsistent results after a program check, all corresponding parameters will be displayed. Likewise, the reference database serves as storage for PASS examples to ensure the stability of optimised test programs.
|Orthogonal top/bottom inspection, angled-view top inspection|
|Image capturing technology||up to 48 megapixels, 24 bit colour depth|
|Resolution||up to 6.5 μm|
|Handling time||3 s|
|Inspection speed||up to 60 cm²/s|
|Angled-view inspection||0°–360° in 1° steps|
|Double-sided PCB inspection||without flipping|
|PCB size / carrier size||up to 610 mm x 460 mm|
|Max. PCB weight||5 kg|
|PCB clearance top side||up to 80 mm|
|PCB clearance bottom side||50 mm|
|Smallest inspectable component||01005 / Pitch 0.3|
|Inline interface||SMEMA, Siemens, Sensor|
|Transportation directions||left-right / right-left / left-left / right-right|
|Power requirements||230 V AC / 1 kVA;
6 bar compressed air, consumption < 20 l/h
|Dimenions (w x d x h)||1,200 mm x 1,652 mm x 1,742 mm|