Safe optical inspection of THT assemblies with OptiCon THT-Line
AOI System for efficient quality assurance of THT Assemblies in the production process. It can be utilised either per manual feeding or as an in-line system utilising a roller conveyor transport system.
Maximum Fault Detection
Unrivalled: multispectral and multidirectional!
PCBs must be illuminated to shed a light on the dark in an AOI system. You may select between many illumination options and variants to show and improve contrasts.
Wrongly soldered components can be clearly detected, i.e. image evaluation is getting more simple and precise.
The powerful OptiCon PILOT software enables the free and easy illumination configuration for respective inspection functions.
Maximum fault detection for highest production quality
The OptiCon THT-Line supports You detecting all typical component and solder faults within a THT production process.
Additionally, the AOI module for the solder side enables the inspection of wave-soldered SMD components.
Integration Variants for the THT Production Process
Space-saving and efficient
The OptiCon THT-Line can be integrated into the individual manufacturing process in different ways. Depending on production process and quality requirements, the AOI modules for the inspection of component and solder sides can be configured differently.
The module for component inspection is integrated in the upper transport segment.
An additional AOI module for solder side inspection can also be integrated – in the upper as well as lower accumulating transport area.
Consequently, the system can inspect both the component side before soldering and solder side during the return transport (see image). In this case, the AOI system is integrated in the production line before the solder oven.
This space-saving solution captivates by the opportunity of a “cold repair” of component faults at additional solder joint inspection in one system.
Parallel component and solder joint inspection
Traceability – more than just a buzzword
GOEPEL electronic offers many further steps for selecting, sorting and processing. There are also several varieties of serial number detection. Therefore, produced and inspected PCBs are traceable without restriction. All results are stored in the system-specific data base and can be reused. In particular, the SPC module for statistical fault analysis is a helpful tool to identify fault types and their origin in the production process.
The new software version provides additional interfaces for connection to quality, factory and traceability systems compliant with ZVEI standard or customer-specific communication versions.
Speed advantage over traditional AOI Systems
The OptiCon THT-Line provides you significant speed advantages by the opportunity of double-sided inspection in one system.
You inspect the PCB bottom side without PCB flipping. Depending on cycle requirements in your production process, the inspection can also be executed by two independent AOI modules in one system.
Hence, additional handling modules for flipping can be omitted and cycle times can be reduced.
OptiCon PILOT – a well-balanced Software Concept
The OptiCon PILOT software provides powerful functions for component recognition, solder joint and short inspection, OCR, colour verification as well as solder paste inspection.
In addition to the intelligent component recognition based on automated characteristic extraction from real images, the solder joint quality is determined by a complex grey value analysis using a range of illumination types.
The integrated reference database guarantees safe and documented fault detection at optimised false call rate. It enables the storage of previously detected faults and their verification after test program modifications. In case of inconsistent results after a program check, all corresponding parameters will be displayed. Likewise, the reference database serves as storage for PASS examples to ensure the stability of optimised test programs.
|Top-side AOI module||Bottom-side AOI module|
|Image capturing technology||CCD matrix camera||CCD matrix camera|
|Colour depth||up to 24 bit||up to 24 bit|
|Integration||in upper transport system||in upper and lower transport system|
|Inspection scope||Presence, placement/positioning, polaritiy and labelling (OCR) of THT assemblies||THT solder joints, SMD components, SMD solder joints|
|Illumination system||multispectral, multi-directional||multispectral, multi-directional|
|Inspection speed||up to 60 cm²/s||up to 100 cm²/s|
|Maximum carrier size||bis zu 620 mm x 510 mm||bis zu 620 mm x 510 mm|
|Maximum inspection area||540 mm x 450 mm||540 mm x 450 mm|
|Inspection height||up to 80 mm||5 mm|
|Clearance||above PCB: 80 mm
below PCB: 20 mm
|above PCB: 80 mm
below PCB: 20 mm
|Power requirements||230 VAC / 2 kVA; 6 bar compressed air, consumption < 20 l/h|
|Carrier transport system||accumulation roller|
|Transportation direction||left-right / right-left /
left-left / right-right
|Inline interface||SMEMA, Siemens, Sensor|
|Dimension (W x D x H)||1150 mm x 1300 mm x 1800 mm|