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Automated Optical Inspection (AOI/AXI)

Optical inspection of THT assemblies

Safe optical inspection of THT assemblies with OptiCon THT-Line

AOI System for efficient quality assurance of THT Assemblies in the production process. It can be utilised either per manual feeding or as an inline system utilising a roller conveyor transport system.

tht assemblies inspection

OptiCon THT-Line enables the automated inspection of THT assemblies with up to 80 mm component height. 

Industriepreis 2012 OptiCon THT-Line wins "Industriepreis 2012" in category "optical technologies".

 

Maximum Fault Detection

Unrivalled: multispectral and multidirectional!

PCBs must be illuminated to shed a light on the dark in an AOI system. You may select between many illumination options and variants to show and improve contrasts.
Wrongly soldered components can be clearly detected, i.e. image evaluation is getting more simple and precise.

The powerful OptiCon PILOT software enables the free and easy illumination configuration for respective inspection functions. 

Maximum fault detection for highest production quality

The OptiCon THT-Line supports You detecting all typical component and solder faults within a THT production process.

Additionally, the AOI module for the solder side enables the inspection of wave-soldered SMD components.

Typical THT solder faults
Typical THT solder faults
Polarity check at an electrolytic capacitor
Polarity check at an electrolytic capacitor
Optical character recognition at a THT component
Optical character recognition at a THT component

Integration Variants for the THT Production Process (inline & stand-alone)

Space-saving and efficient

The OptiCon THT-Line can be integrated into the individual manufacturing process in different ways. Depending on production process and quality requirements, the AOI modules for the inspection of component and solder sides can be configured differently.

The module for component inspection is integrated in the upper transport segment.

An additional AOI module for solder side inspection can also be integrated – in the upper as well as lower accumulating transport area.

Consequently, the system can inspect both the component side before soldering and solder side during the return transport (see image). In this case, the AOI system is integrated in the production line before the solder oven.

This space-saving solution captivates by the opportunity of a “cold repair” of component faults at additional solder joint inspection in one system.

OptiCon THT-Line integration example
OptiCon THT-Line integration example

Parallel component and solder joint inspection

Configuration example for parallel component and solder joint inspection
Configuration example for parallel component and solder joint inspection

Of course, the OptiCon THT-Line is available in other configuration settings.  Depending on required cycle time, component and solder side inspections can be executed in parallel or successively.

The system is also available with manual loading opportunities for offline utilization.

Traceability – more than just a buzzword

GOEPEL electronic offers many further steps for selecting, sorting and processing. There are also several varieties of serial number detection. Therefore, produced and inspected PCBs are traceable without restriction. All results are stored in the system-specific data base and can be reused. In particular, the SPC module for statistical fault analysis is a helpful tool to identify fault types and their origin in the production process.

The new software version provides additional interfaces for connection to quality, factory and traceability systems compliant with ZVEI standard or customer-specific communication versions.

itac SoftwareZVEICompControl

Double-sided Inspection

Gain in time: double-sided PCB inspection without flipping within the OptiCon THT-Line
Gain in time: double-sided PCB inspection without flipping within the OptiCon THT-Line

Speed advantage over traditional AOI Systems

The OptiCon THT-Line provides you significant speed advantages by the opportunity of double-sided inspection in one system.

You inspect the PCB bottom side without PCB flipping. Depending on cycle requirements in your production process, the inspection can also be executed by two independent AOI modules in one system.

Hence, additional handling modules for flipping can be omitted and cycle times can be reduced.

OptiCon PILOT – a well-balanced Software Concept

OptiCon PILOT

Software concept
Software concept

The OptiCon PILOT software provides powerful functions for component recognition, solder joint and short inspection, OCR, colour verification as well as solder paste inspection.

In addition to the intelligent component recognition based on automated characteristic extraction from real images, the solder joint quality is determined by a complex grey value analysis using a range of illumination types.

Reference-Database

Reference database

The integrated reference database guarantees safe and documented fault detection at optimised false call rate. It enables the storage of previously detected faults and their verification after test program modifications. In case of inconsistent results after a program check, all corresponding parameters will be displayed. Likewise, the reference database serves as storage for PASS examples to ensure the stability of optimised test programs.

 

Inspection Parameters

Top-side AOI module Bottom-side AOI module
Image capturing technology CCD matrix camera CCD matrix camera
Colour depth up to 24 bit up to 24 bit
Integration in upper transport system in upper and lower transport system
Inspection scope Presence, placement/positioning, polaritiy and labelling (OCR) of THT assemblies THT solder joints, SMD components, SMD solder joints
Illumination system multispectral, multi-directional multispectral, multi-directional
Inspection speed up to 60 cm²/s up to 100 cm²/s
Maximum carrier size bis zu 620 mm x 510 mm bis zu 620 mm x 510 mm
Maximum inspection area 540 mm x 450 mm 540 mm x 450 mm
Inspection height up to 80 mm 5 mm
Clearance above PCB: 80 mm
below PCB: 20 mm
above PCB: 80 mm
below PCB: 20 mm

System Specifications

Power requirements 230 VAC / 2 kVA; 6 bar compressed air, consumption < 20 l/h
Carrier transport system accumulation roller
Transportation direction left-right / right-left /
left-left / right-right
Inline interface SMEMA, Siemens, Sensor
Dimension (W x D x H) 1150 mm x 1300 mm x 1800 mm
GOEPEL electronics Ltd., Unit 1A, The Old Granary, Westwick, Cambridge, CB24 3AR
Phone +44-1223-858298, Fax +44-1223-257800, www.goepel.co.uk