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Automated Optical Inspection (AOI/AXI)
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OptiCon AdvancedLine

OptiCon AdvancedLine

OptiCon AdvancedLine

Inline AOI System for flexible Integration Opportunities

The OptiCon AdvancedLine AOI system’s decisive advantage is the multitude of opportunities for inline integration into the production process. The system can be utilized at each position in a PCB production line. No requirements or specifications will remain unfulfilled as your boards can be transported in each direction.

The OptiCon AdvancedLine can be applied inline and also as a stand-alone system.

Additionally, the system captivates through opportunities with camera and illumination configurations. The sum of all components and parameters incl. high resolution and inspection safety guarantees the highest quality for your mounted PCBs.

Component inspection with visible light and with infrared illumination
Component inspection with visible light and with infrared illumination
Effect of illumination variants on a SMD component
Click the image to view illumination variants

Unique Illumination from Infrared to Ultraviolet

PCBs must be illuminated to shed a light on the dark in an AOI system. You may select between many illumination options and variants to show and improve contrasts.
Wrongly soldered components can be clearly detected, i.e. image evaluation is getting more simple and precise.

The illumination colours in the OptiCon systems can be freely selected from infrared to ultraviolet. It is also possible to control light intensity and directions. The many light variants enable the visibility also of low-contrast components, polarity marks, differences in material and pollutions.

Patented 360° Inspection in 1° Steps at constant Resolution and Definition

With our 360° inspection we check your mounted PCB all around. Resolution and definition remain constant in the entire field-of-view. Each angle of any component becomes visible, and hidden solder joints are not an issue any longer. Imaging in rotating 1° steps enable an ideal inspection for nearly all placement situations and pad geometries.

Program Optimization by means of statistically recorded Inspection Data

As factors of the daily production process, variations in the production process and component changes cannot be avoided. The software in our AOI systems provides high-performance functionalities to solve these problems efficiently.

The statistical evaluation of the single measured data enables comfortable definition of tolerances. Additionally, the integrated reference data base guarantess a stable inspection quality.

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360° angled-view inspection in 1° steps and 3D

Flexible Camera Configurations

Inspection modules for various speeds...

The inspection modules in the AOI system can be configured in three speed levels according to the production process cycle times. Various field-of-view sizes and different methods of image capture make the differences.

Resolution and image quality are identical in all configuration variants, leading to maximum fault detection.


3D glasses free of chargeAutomated Optical Inspection in stereoscopic view. Get a three-dimensional view on mounted PCBs.

Please order your three-dimensional glasses free of charge!

...and for various test tasks

The AOI system utilizes an orthogonal standard camera module for the inspection of SMD components and solder joints as well as THT/THR solder joints. As a supplement for maximum fault detection, the camera module “Chameleon” with patented 360° angled-view inspection in 1° steps can be integrated.

Add-on cameras for the inspection of THT components or microscopic resolutions (down to 3.2 µm) are available. Hence, the system is perfectly suited for your production range.

For measuring tasks in the third dimension, there is an optional laser height measurement system with a resolution of few micro meters.

Example for inline fault verification after AOI Inspection
Example for inline fault verification after AOI Inspection

Individual integration opportunities

The OptiCon AdvancedLine can be individually integrated into your production process. There are several options:

For example, with respect to the PCB transport directions – into the system and out of the system – the mounted assemblies are sorted into respective magazining stations based on the inspection results.

Double-sided PCB inspection combined with a turning station, where Pass-Fail sorting is done by means of the AOI test results, is another example. Moreover, offline programming allows for program generation without affecting test throughput.

Traceability – more than just a buzzword

GOEPEL electronic offers many further steps for selecting, sorting and processing. There are also several varieties of serial number detection. Therefore, produced and inspected PCBs are traceable without restriction. All results are stored in the system-specific data base and can be reused. In particular, the SPC module for statistical fault analysis is a helpful tool to identify fault types and their origin in the production process.

The new software version provides additional interfaces for connection to quality, factory and traceability systems compliant with ZVEI standard or customer-specific communication versions.

itac SoftwareZVEICompControl

OptiCon PILOT – a well-balanced Software Concept


Software concept
Software concept

The OptiCon PILOT software provides powerful functions for component recognition, solder joint and short inspection, OCR, colour verification as well as solder paste inspection.

In addition to the intelligent component recognition based on automated characteristic extraction from real images, the solder joint quality is determined by a complex grey value analysis using a range of illumination types.


Reference database

The integrated reference database guarantees safe and documented fault detection at optimised false call rate. It enables the storage of previously detected faults and their verification after test program modifications. In case of inconsistent results after a program check, all corresponding parameters will be displayed. Likewise, the reference database serves as storage for PASS examples to ensure the stability of optimised test programs.


Inspection Parameters

Orthogonal top inspection, angled-view top inspection
Image capturing technology up to 48 megapixels, 24 bit colour depth
Lens telecentric
Resolution up to 3,2 μm
Illumination multispectral, multi-directional
Inspection speed up to 60 cm²/s
Angled-view inspection 0°–360° in 1° steps
PCB size up to 800 mm x 450 mm
Max. PCB weight 5 kg
PCB clearance top side up to 65 mm
PCB clearance bottom side 50 mm
Smallest inspectable component 01005 / Pitch 0.3

System Specifications

Inline interface SMEMA, Siemens, Sensor
Transportation directions left-right / right-left /
left-left / right-right
Power requirements 230 V AC / 1 kVA; 6 bar compressed air, consumption < 20 l/h
Dimensions (w x d x h) 1,000 mm x 1,330 mm x 1,500 mm
Weight ca. 580 kg